Low Temperature Hot Melt H2235 is an outstanding high performance hot melt adhesive, specially formulated to have a low viscosity and for low temperature applications. It has been found suitable for bonding materials such as paper and board, varnished and coated board stock, timber, hardboard, foams, and other porous and non-porous materials.
This low temperature hot melt is opaque / white in appearance, flexible, with good flow characteristics and tack. Low Temperature Hot Melt H2235 is acceptable under Section 175.105 of the USA FDA regulations for use as a food packaging adhesive.
For low temperature applications within the food packaging, printing, furniture, and product assembly markets.
The 5kg box contains approximately 160-170 sticks of hot melt.
|Heat Resistance||-40°C to 70°C|
|Open Time||Up to 40 seconds|
|Working Temperature||140°C to 175°C|